Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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1155 SMT / PCB Assembly Related Technical Articles

Coat-and-Print Patterning of Silver Nanowires for Flexible and Transparent Electronics

Feb 19, 2020 | Weiwei Li, Azat Meredov, Atif Shamim

Silver nanowires (Ag NWs) possess excellent optoelectronic properties, which have led to many technology-focused applications of transparent and flexible electronics. Many of these applications require patterning of Ag NWs into desired shapes, for which mask-based and printing-based techniques have been developed and widely used. However, there are still several limitations associated to these techniques. These limitations, such as complicated patterning procedures, limited patterning area, and compromised optical transparency, hamper the efficient fabrication of high-performance Ag NW patterns. Here, we propose a coat-and-print approach for effectively patterning Ag NWs....

Publisher: Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab

Integrated Microwave Packaging Antennas and Circuits Technology (IMPACT) Lab

IMPACT lab is focused on cutting-edge research in innovative antenna designs, RF circuits, and sensors.

Thuwal, Saudi Arabia

Research Institute / Laboratory

Selective protection for PCBs

Feb 18, 2020 | Scheugenpflug

Glob Top, Dam and Fill & Flit Chip Underfill To protect PCBs from damaging outside influences, they are coated with a thin layer of casting resin or protective finish during the conformal coating process. In addition to sealing the entire circuit board, it is possible to pot only sections or individual components on the substrate. Different methods ranging from "glob top" to "dam and fill" and "flip chip underfill" have been developed for this purpose....

Publisher: Scheugenpflug Inc.

Scheugenpflug Inc.

Specializes in automated metering & dispensing solutions, supplier of resin metering systems, global expert in production and process automation, vacuum dispensing production systems, and systems for dispensing of abrasive media.

Kennesaw, Georgia, USA

Manufacturer of Assembly Equipment, Adhesives / Dispensing, Assembly, Component Preparation

Process Engineering - Why is preparation of adhesive bonding and potting materials necessary?

Feb 14, 2020 | Scheugenpflug

To meet the steady increase in technical requirements for electronic components, potting media properties must be extremely precise. Rheology, viscosity, filler content and curing behavior are only a few of the factors that play a role in their practical use. However, the growing complexity of materials often negatively impacts the ability to process or dispense them. In this case, material preparation and feeding systems specially designed for this purpose are required. These systems optimally prepare the material for the actual application and ensure homogeneous feeding to the dispensing system....

Publisher: Scheugenpflug Inc.

Scheugenpflug Inc.

Specializes in automated metering & dispensing solutions, supplier of resin metering systems, global expert in production and process automation, vacuum dispensing production systems, and systems for dispensing of abrasive media.

Kennesaw, Georgia, USA

Manufacturer of Assembly Equipment, Adhesives / Dispensing, Assembly, Component Preparation

How to achieve optimum results in automated dispensing

Feb 13, 2020 | Scheugenpflug

Efficient bonding, sealing and potting has a major influence on the sustainable function and safety of electronic components. The key to success here lies in the comprehensive view and control of process engineering. Here it pays to seek collaboration with the systems and the material manufacturer during the very early stages of the project. This is because dispensing systems must be selected for compatibility with the workpiece and the adhesive, sealant or potting compound used. And there are also other factors that play an important role in designing the optimum dispensing system:...

Publisher: Scheugenpflug Inc.

Scheugenpflug Inc.

Specializes in automated metering & dispensing solutions, supplier of resin metering systems, global expert in production and process automation, vacuum dispensing production systems, and systems for dispensing of abrasive media.

Kennesaw, Georgia, USA

Manufacturer of Assembly Equipment, Adhesives / Dispensing, Assembly, Component Preparation

Size Matters - The Effects of Solder Powder Size on Solder Paste Performance

Feb 12, 2020 | Tony Lentz

Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is “when should we switch from Type 3 to a smaller solder powder?” Solder powder size is usually chosen based on the printing requirements for the solder paste. It is common practice to use IPC Type 4 or 5 solder powders for stencil designs that include area ratios below the recommended IPC limit of 0.66. The effects of solder powder size on printability of solder paste have been well documented.</p><p>The size of the solder powder affects the performance of the solder paste in other ways. Shelf life, stencil life, reflow performance, voiding behavior, and reactivity / stability are all affected by solder powder size. Testing was conducted to measure each of these solder paste performance attributes for IPC Type 3, Type 4, Type 5 and Type 6 SAC305 solder powders in both water soluble and no clean solder pastes. The performance data for each size of solder powder in each solder paste flux was quantified and summarized. Guidance for choosing the optimal size of solder powder is given based on the results of this study....

Publisher: FCT ASSEMBLY, INC.

FCT ASSEMBLY, INC.

With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.

Greeley, Colorado, USA

Manufacturer of Assembly Material, Soldering

Accurately Capturing System-Level Failure of Solder Joints

Feb 05, 2020 | Maxim Serebreni

Consortium Projects - Thermal Cycling Reliability</p> <ul> <li>Consortium projects allow for joint research to investigate the reliability of multiple solder alloys under a variety of environmental stress conditions. </li> <li>Project jointly sponsored by iNEMI and HDP User Group and including CALCE and Universal consortium currently assessing 15 third-generation solder alloys..</li> </ul>...

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

Mechanical Drop Shock Testing

Feb 03, 2020 | ACI Technologies, Inc.

Accurate impact testing is a key component to establishing that a product is not only reliable, but durable in an end-use environment. ACI Technologies tested a high-g circuit board to demonstrate component durability and ruggedization for guided munitions. The Lansmont Model 23 Shock Test System customized with a Dual Mass Shock Amplifier was used for this testing (Figure 1)....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Jan 28, 2020 | Heller Industries

This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers....

Publisher: Heller Industries Inc.

Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Florham Park, New Jersey, USA

Manufacturer of Assembly Equipment, Soldering, OEM

Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies

Jan 22, 2020 | Gonzalo Fernandez, Ana Collado

Flip chip assembly techniques bring a wide range of benefits:</p> <ul> <li>Reduced parasitic interconnection between the semiconductor die and package.</li> <li>Provides a high final assembly integrity density.</li> <li>Minimize the interconnection length, providing better electrical performances, especially for high speed signals.</li> <li>Reduce the device size and weight,…, etc.</li> </ul> <p>But there is no dedicated inspection requirements nor DPA standard which address all the necessary aspects associated to this construction type or only cover partially the topics to be inspected....

Publisher: ALTER TECHNOLOGY

ALTER TECHNOLOGY

A leading company in the fields of engineering, procurement and testing of high reliability components and electronic equipment within the space and other high reliability markets.

41092, Spain

Test Services

Ultra-Thin Chips For High-Performance Flexible Electronics

Jan 15, 2020 | Shoubhik Gupta, William Taube Navaraj, Leandro Lorenzelli, Ravinder Dahiya

Flexible electronics has significantly advanced over the last few years, as devices and circuits from nanoscale structures to printed thin films have started to appear. Simultaneously, the demand for high-performance electronics has also increased because flexible and compact integrated circuits are needed to obtain fully flexible electronic systems. It is challenging to obtain flexible and compact integrated circuits as the silicon based CMOS electronics, which is currently the industry standard for high-performance, is planar and the brittle nature of silicon makes bendability difficult. For this reason, the ultra-thin chips from silicon is gaining interest. This review provides an in-depth analysis of various approaches for obtaining ultra-thin chips from rigid silicon wafer. The comprehensive study presented here includes analysis of ultra-thin chips properties such as the electrical, thermal, optical and mechanical properties, stress modelling, and packaging techniques. The underpinning advances in areas such as sensing, computing, data storage, and energy have been discussed along with several emerging applications (e.g., wearable systems, m-Health, smart cities and Internet of Things etc.) they will enable. This paper is targeted to the readers working in the field of integrated circuits on thin and bendable silicon; but it can be of broad interest to everyone working in the field of flexible electronics....

Publisher: Bendable Electronics and Sensing Technologies (BEST)

Bendable Electronics and Sensing Technologies (BEST)

Our research revolves around the development of high-performance electronics and sensing systems on large area flexible substrates.

Glasgow, Scotland

School

Atomic Layer Deposition

Jan 13, 2020 | ACI Technologies, Inc.

Is it possible to coat electronic assemblies with a thin, uniform in thickness, pinhole-free, moisture impervious, truly hermetic (by the MIL-STD-883 definition) film of ceramic material that is far more affordable than placing the same electronic assemblies in the currently used glass-to-metal sealed, thick, heavy, metal-and-ceramic-based hermetic enclosures? Since the coating (called a “conformal coating”) would be both hermetic (moisture proof) and hundreds or thousands of times thinner than the currently used enclosures, it would be both less expensive, lighter, and still just as effective in excluding moisture (hermetic) as the current heavy, bulky, expensive electronic enclosures are....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms

Jan 09, 2020 | Philipp Nothdurft, Gisbert Riess, Wolfgang Kern

PCBs have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing....

Publisher: Polymer Competence Center Leoben GmbH

Polymer Competence Center Leoben GmbH

PCCL is the leading Austrian "Center of Excellence" for cooperative research in the area of polymer engineering and sciences.

Leoben, Austria

Research Institute / Laboratory

Using mini PCB magazine loader to save more space for your SMT assembly line

Jan 06, 2020 | ASCEN technology company

ASCEN technology make the mini PCB magazine loader without magazine rack to save more space for most of production line,PCB mini loader can use as the PCB unloader or loading machine in different station and let the factory maximized to using the space...

Publisher: ASCEN Technology

ASCEN Technology

Manufacturer of automated production systems;PCB magazine loader,PCB separator,PCB cutting machine,PCB unloaders, PCB conveyors,PCB depaneling machines,PCB turn conveyors,PCB conformal coaters,PCB solder paste printer,PCB buffer

Dongguan, Guangdong, China

Manufacturer of Assembly Equipment, Cleaning, Screen Printing, Manufacturer of Test Equipment, Selective Soldering

Counterfeit Component Analysis

Jan 02, 2020 | ACI Technologies, Inc.

A customer contacted the Helpline with the concern that parts being used in their assembly may possibly be counterfeit components. The counterfeiting of electronics components is a world-wide problem, and the threat today is even more evident than ever before. Any company, large or small, that manufactures assemblies using electronics components is equally susceptible to using counterfeit devices in their assemblies. In most cases, counterfeit components aren’t discovered until after the component has already been placed on a printed circuit board (PCB), usually during first article electrical test. At this point, the only recourse is to debug the circuit to determine the faulty component and rework each PCB already in production to replace the faulty component. As one might easily surmise, this is a rather costly process; world-wide, counterfeit components account for over $15B loss in sales annually! ...

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Temperature Cycling and Fatigue in Electronics

Jan 01, 2020 | Gilad Sharon, Ph.D., Greg Caswell

The majority of electronic failures occur due to thermally induced stresses and strains caused by excessive differences in coefficients of thermal expansion (CTE) across materials.</p><p>CTE mismatches occur in both 1st and 2nd level interconnects in electronics assemblies. 1st level interconnects connect the die to a substrate. This substrate can be underfilled so there are both global and local CTE mismatches to consider. 2nd level interconnects connect the substrate, or package, to the printed circuit board (PCB). This would be considered a "board level" CTE mismatch. Several stress and strain mitigation techniques exist including the use of conformal coating....

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

PCBONLINE rigid capability

Dec 30, 2019 | Ada

(ROHS, Halogen Free & Reach Compliance) FR-4 (Tg130-180): ShengYi, ITEQ, KB, Huazheng High Speed FR4, Ceramics & Telflon, Rogers...

Publisher: PCB ONLINE LIMITED

How to choose the material of PCB ?

Dec 30, 2019 | Ada

How to choose the material of PCB ? The choice of PCB material must meet the design requirements, the quality of production and cost need to achieve a balance. The design requirements include electrical and institutional parts. This material problem is usually important when designing very high speed PCB boards (frequencies greater than GHz). For example, the commonly used FR-4 material may not be used when dielectric loss at several GHz frequencies, which can have a significant effect on signal attenuation . In the case of electrical, it is important to note whether the dielectric constant and the dielectric loss are combined at the designed frequency...

Publisher: PCB ONLINE LIMITED

A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism

Dec 26, 2019 | Yaqiu Li, Weiwei Hu, Yufeng Sun, Zili Wang, Ali Mosleh

Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration.</p><p>In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB....

Publisher: Beihang University

Beihang University

Beihang University, previously known as Beijing University of Aeronautics and Astronautics is a major public research university located in Beijing, China, emphasizing engineering, technology, and the hard sciences.

Beijing, China

School

Critical Evaluation of Laboratory Potentiometric Electronic Tongues for Pharmaceutical Analysis - An Overview

Dec 18, 2019 | Małgorzata Łabańska, Patrycja Ciosek-Skibińska, Wojciech Wróblewski

Electronic tongue systems equipped with cross-sensitive potentiometric sensors have been applied to pharmaceutical analysis, due to the possibility of various applications and developing new formulations. Many studies already proved the complementarity between the electronic tongue and classical analysis such as dissolution tests indicated by Pharmacopeias. However, as a new approach to study pharmaceuticals, electronic tongues lack strict testing protocols and specification limits; therefore, their results can be improperly interpreted and inconsistent with the reference studies. Therefore, all aspects of the development, measurement conditions, data analysis, and interpretation of electronic tongue results were discussed in this overview. The critical evaluation of the effectiveness and reliability of constructed devices may be helpful for a better understanding of electronic tongue systems development and for providing strict testing protocols....

Publisher: Warsaw University of Technology

Warsaw University of Technology

WUT is a research intense, doctoral level academic institution focused on undergraduate and graduate programs almost exclusively in engineering and applied sciences.

Warsaw, Poland

School

Factors determine the price of temperature humidity test chamber

Dec 16, 2019 | climatest symor

When we were children,our parents always warn us "Do comparison shopping before you buy",why they say like this?this is a very simple truth, for the first deal,we are always cautious, through continuous comparison in order to find out the best quality, service, after-sale and price. This apply to any industry,there are many manufacturers of environmental test equipment. When some customers inquire a temeprature humidity test chamber, they will find a very common problem. Why is the price of the same equipment quoted by the two manufacturers very different? 1, the chamber body process,which effects the exterior case quality,this price has a gap. 2, the components, esp.components of the refrigeration system, is the core value of the temperature humidity test chamber. 3, even if the body and refrigeration components are the same, some prices are different, that is the manufacturer technical level. 4, regional issues, Wuxi,Changzhou, Dongguan, these brands need to know more. 5. after-sales, a powerful manufacturer often with a sound after-sales service dept.. The above are both technical and service, as well as the delivery cost of goods to the local and overseas are different....

Publisher: Symor Instrument Equipment Co.,Ltd

Symor Instrument Equipment Co.,Ltd

Climatest Symor® is the leading environmental simulation testing equipment manufacturer in China established in 2001, located at Dayang Industrial Park,Hefei,China.

Hefei, China

Manufacturer of Test Equipment

Difference between Neutral and Acid Salt Spray Corrosion Test

Dec 13, 2019 | climatest symor

Salt spray corrosion chamber can test the ability of material and its protective layer to resist salt mist corrosion, or compare the process quality of similar protective layers, at the same time; this equipment is suitable for parts, electronic components, protective layer of metal material and other industrial products. Salt spray test is divided into neutral and acid test. What is the difference between neutral and acid in salt spray test? First, the temperature applied in the test method is different: Neutral test: a. Laboratory:35°C ±1°C, b. Saturated air drums:47°C ±1°C Acid test: a. Laboratory:50°C ±1°C, b. Saturated air drums:63°C ±1°C Second, the production material is different,neutral test chamber adoptes the traditional PVC plates, acid test chamber asopts PP sheet,which is more high temperature resistance and suits strong acid test. Third. Different test methods satisfied Neutral salt spray chamber according to GB/T 2423.17-2008, GB/T 2423.18-2000< basic rules for electrical and electronic products test Ka >, salt spray test method and GB/T 10125-1997, GB/T 10587-2006, GB10593.2-1990, GB/T 1765-1979, GB/T 1771-2007, GB/T 12967.388, GB/T 1705.8-2008, etc. In addition to the test methods specified in the national standard, acid salt spray chamber also needs to expand the standard setting such as IEC,MIL,DIN,ASTM,IS,CNS. Last, Comparison of neutral test solutions China: NaCI distilled water solution NaCI mass concentration (50 ±5) g ≤ l pH value 6.5 ≤ 7.2 United States: distilled water solution NaCI mass concentration 5% ±1% pH value 6.5 ≤ 7.2 Germany: NaCI distilled water solution NaCI mass concentration (50 ±5) g ≤ l pH value 6.5 ≤ 7.2 Japan: NaCI distilled water solution NaCI mass concentration 5% ±1% pH pH value 6.5 ~ 7.2 France: NaCI distilled water solution NaCI mass concentration 5% pH 6.5 ≤ 7.2 http://climatechambers.com/articles&latestnews/difference-between-neutral-and-acid-salt-spray-corrosion-test.html...

Publisher: Symor Instrument Equipment Co.,Ltd

Symor Instrument Equipment Co.,Ltd

Climatest Symor® is the leading environmental simulation testing equipment manufacturer in China established in 2001, located at Dayang Industrial Park,Hefei,China.

Hefei, China

Manufacturer of Test Equipment

Voids in Solder Joints

Dec 12, 2019 | Raiyo Aspandiar

Presented at SMTA Boise Expo and Tech Forum, March 20, 2018...

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer of Components

What causes temperature humidity chamber to alarm?

Dec 12, 2019 | climatest symor

Today we discuss the reason that causes temperature humidity chamber to alarm,In most cases, the equipment alarm is caused by the improper operation in the process of use, which mainly includes following reasons:that are refrigeration system, temperature system and circulating system. First, Refrigeration system 1, refrigeration compressor overpressure alarm. If the refrigerant pressure exceeds the set value, it will stop and alarm at the same time. At this time, the fault must be eliminated and then manually reset. 2, short phase power supply, phase sequence alarm. When the external power supply of the equipment is out of phase or the phase sequence is changed, it will stop and alarm at the same time. 3. The circulating cooling water is short of water to alarm. When the water pressure of the cooling circulating water system is insufficient, it will stop and alarm at the same time, and it must wait for the fault to be eliminated and reset at the same time before it could run normally. 4, refrigeration compressor overheating alarm. When the coil of the compressor is overheated and the power supply of the line is not normal, it will stop and alarm at the same time. Second, Temperature system 1, the overtemperature alarm in the chamber. The sensors in the channel and the sample area are equipped with overtemperature protection devices, and there are also overtemperature protecter on the control panel. When the temperature in the working chamber exceeds the setting value on the controller, it will stop and alarm. 2. sample overtemperature protection. When the temperature in the sample area exceeds the protection temperature set by the controller, it will stop and alarm at the same time. The overtemperature protection of the sample is divided into upper limit protection and lower limit protection, which can be set according to the demand, Third,Circulating system 1. The alarm is caused by the overheating of the circulating fan. When the coil of the fan is over-heated, the alarm will be stopped at the same time. 2. The fan over-current alarm. When the current of the fan exceeds the allowable value, the alarm is stopped at the same time, and the normal operation can only be carried out after the fault maintenance of the overcurrent is completed. This is what we talk about today,if you have more questions,let us know....

Publisher: Symor Instrument Equipment Co.,Ltd

Symor Instrument Equipment Co.,Ltd

Climatest Symor® is the leading environmental simulation testing equipment manufacturer in China established in 2001, located at Dayang Industrial Park,Hefei,China.

Hefei, China

Manufacturer of Test Equipment

Masking for Conformal Coatings

Dec 05, 2019 | ACI Technologies

Conformal coatings are regularly employed to protect the surface of a soldered printed circuit board assembly from moisture, chemicals in the PCBA's service environment, and foreign objects or debris. Conformal coatings are nonconductive and therefore cannot be placed on any location where electrical contact will be required, such as connector pins, test points, and sockets. Conformal coatings are also not permitted on any mechanical interface location, such as mounting holes or brackets, to assure the proper fit between items in the final assembly. In order to apply conformal coatings to an assembly and comply with the restrictions on keep-out areas, masking is employed to protect those surfaces. ...

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Key Technology Choices For Optimal Massive IoT Devices

Nov 26, 2019 | Claes Lundqvist, Ari Keranen, Ben Smeets, John Fornehed, Carlos, R.B. Azevedo, Peter Von Wrycza

The latest cellular communication technologies LTE-M and NB-IoT enable the introduction of a new generation of IoT devices that deliver on the promise of scalable, cost-effective massive IoT applications using LPWAN technology. However, a few key technology choices are necessary to create IoT devices that can support the multitude of existing and emerging massive IoT use cases.....

Publisher: Ericsson AB

Ericsson AB

Ericsson AB manufactures and markets radio and television communication equipment. The company was formerly known as Ericsson Radio Systems AB. Ericsson AB (Sweden) operates as a subsidiary of Ericsson.

Stockholm, Sweden

Other

Why salt spray chamber fail to spray salt mist?

Nov 20, 2019 | climatest symor

Salt spray test chamber is used to test teh salt corrosion resistance ability of hardware, metal and other auto parts,the chamber can quickly detect the corrosion resistance degree of products in the temperature, humidity and salt spraying environment, which can effectively improve production efficiency. So what is the reason why such a salt spray test chamber does not spray? As per our past maintenance experience,there are below reasons,customers can have a look,hope it is helpful: 1, the spray tower is blocked; 2, water pipes clogged, water flow can not go in; 3, the air compressor stops running,pls open the air compressor button; 4, main switch of the air compressor outlet is not turned on,pls turn on. 5, the solenoid valve fails, the pressure meter is broken or the pressure is too low, pls check with Climatest and repair it. 6, when the nozzle is clogged, the nozzle should be carefully removed and cleaned,because it is fragile. 7, if the spray pressure is normal, the position of the nozzle glass is also correct, but what is the reason for not spraying? In this case, it is necessary to carefully observe whether there is dirt at the contact surface of the nozzle. If so, clean up the dirt and the spray can be carried out normally. That‘s all we‘re going to talk about today. If you have any questions, follow us on facebook, Please feel free to ask us questions....

Publisher: Symor Instrument Equipment Co.,Ltd

Symor Instrument Equipment Co.,Ltd

Climatest Symor® is the leading environmental simulation testing equipment manufacturer in China established in 2001, located at Dayang Industrial Park,Hefei,China.

Hefei, China

Manufacturer of Test Equipment

5G - The Future of IoT

Nov 20, 2019 | 5g Americas

5G: The Future of IoT takes a look at the market drivers, trends and cellular technology solutions that will create our connected future.</p><p> Market drivers provide added value through connectivity of all “things” ranging from street lighting to home appliances to industrial robotics. Providing connectivity to things has become easier with improvements in the economics of end devices, large investments in IoT systems, adoption of global standards and availability of spectrum. Overall trends in information technology such as cloud computing and edge cloud, artificial intelligence and security assurance have accelerated the IoT ecosystem. The whitepaper discusses some of the market segments in more details, including industrial IoT, smart cities, enterprise IoT and consumer IoT....

Publisher: 5G Americas

5G Americas

5G Americas advocates for and facilitates the advancement of 5G and the transformation of LTE networks throughout the Americas.

Bellevue, Washington, USA

Association / Non-Profit

Maintenance and operation of walk-in temperature humidity test chamber

Nov 17, 2019 | climatest symor

Overview of walk-in temperature and humidity chamber: It also belongs to environmental test equipment, it tests whether the product can resist high temperature, low temperature, humidity, or the physical and chemical changes produced under extreme conditions, the walk-in temperature and humidity chamber volume is large, the product is placed, or a large object can be placed, such as automobile, new energy, television and liquid crystal screen, etc. How to do the routine maintenance of the walk-in temperature and humidity chamber: 1. The wet gauze basically, if there is no special case, s/b usually changed once in 3 months 2. The water channel shall be regularly cleaned, including water cup, water tank, etc., so as to prevent the water from being blocked,affect the humidity test. 3. It is forbidden to test the flammable and explosive products inside working room. 4. Clean the chamber on a regular basis 2. How to operate walk-in temperature and humidity chamber: The operation method is same as standard temperature humidity test chamber,the controller is 7-inch LCD programmable color screen, you only need to setthe temperature point---test time--how many cycles need to be tested, This can be done automatically, and the machine will stop automatically when it is complete. If there is any problem during the operation, the corresponding problem point will be displayed on the machine control screen. Walk-in temperature and humidity chamber is a must equipment for reliability test of Automobile,Aerospace,Electronic parts,etc,the operation and maintenance are easy,it is teh tear down mahcine,Climatest engineers will be dispatched to do on-site support,for instance,we will finish commissioning,train customers how to operate,maintain,welcome to follow our company facebook page:http://www.facebook.com/Climatechambers...

Publisher: Symor Instrument Equipment Co.,Ltd

Symor Instrument Equipment Co.,Ltd

Climatest Symor® is the leading environmental simulation testing equipment manufacturer in China established in 2001, located at Dayang Industrial Park,Hefei,China.

Hefei, China

Manufacturer of Test Equipment

Material Aging Test-UV Weathering Test Chamber

Nov 15, 2019 | climatest symor

Material Aging Test-UV Weathering Test Chamber 1.What is UV aging? UV aging chambers use fluorescent ultraviolet lamp as light source to simulate UV radiation and condensation in natural sunlight, and to carry out accelerated weather resistance test in order to obtain the result of weather resistance of the material. UV aging detection is widely used in non-metallic materials, organic materials (such as coatings, paints, rubber, plastics and their products) under the change of sunlight, humidity, temperature, condensation and other climatic conditions to test the aging degree and situation of related products and materials. 2.Why we should do UV aging test? When the product is placed in the ambient environment, there will be different problems taken place, such as appearance changes, including cracking, speckle, powdering or color change, and even performance degradation,which may be due to the loss of components in the resin resulting in chemical bonds changes inside the molecular structure, this is mainly caused by sunlight, industrial exclusion of waste gas, bacteria and so on. The aging performance of the product directly affects the lifespan of the product, so aging test become significant,non-metallic materials, organic materials (such as paints, paints, rubber, plastics and their products) are subject to changes in sunlight, humidity, temperature, condensation and other climatic conditions to test the degree and condition of aging of related products and materials. The natural aging test is to put the plastic specimen under the sun exposure, and it is directly under the natural climate environment,to test the material performance under various factors such as light, heat energy, atmospheric humidity, oxygen and ozone, industrial pollution and the like, the most harsh climate condition should be selected,or near the actual application area of the material, the test site shall be open and flat, no obstacle to affect the test results,the specimen holder shall be facing the equator and at an angle of 45 ° from the ground. When the main performance index of the specimen has been reduced, the test s/b terminated when it achieve the minimum allowable use value . in most case,the test is terminated when the product primary performance index falls to 50% of the initial value. The natural aging process is a very slow process, and there is a great difference in different geographical conditions, which brings difficulties to evaluate the aging resistance of the product. It is an attempt to make an evaluation of the aging performance of the plastic in a shorter time,that is accelerated aging test. The accelerated aging test can be used to simulate the human light source of the fluorescent lamp, including the carbon arc lamp, the xenon arc lamp and the fluorescent ultraviolet lamp, and the artificial light sources can generate more light than the natural sunlight on the ground. When these artificial light sources are used, it is also common to use the combination of the condenser to simulate the rain drop, the dew and the like to conduct the aging test on the product....

Publisher: Symor Instrument Equipment Co.,Ltd

Symor Instrument Equipment Co.,Ltd

Climatest Symor® is the leading environmental simulation testing equipment manufacturer in China established in 2001, located at Dayang Industrial Park,Hefei,China.

Hefei, China

Manufacturer of Test Equipment

Fiber Optic Cabling

Nov 13, 2019 | ACI Technologies, Inc.

Fiber optic harnesses appear simple, but they have been designed to maintain all of the critical areas of aligning two fibers and minimize the losses associated with a break in the transmission path. In order to understand how the connectors overcome alignment issues, we must first understand the issues. Fiber optic communications networks use specific wavelengths of light (or colors) to transmit information through a clear fiber at high speed. They use the property of internal reflection along the fiber’s axis to contain the light and keep the optical power high enough to be detected at the receiving end. ...

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Serious to make dry oven

Nov 13, 2019 | climatest symor

Dry oven is a must instrument almost for every laboratory in different industries,with nearly 20 years efforts and innovation,Climatest now masters core technique of dry oven manufacturing,no matter on temperature uniformity or temperature stability.Behind the quality is 15 years of consistent persistence,strong belief in excellence; from design to R & D to production, from promotion to sales to installation; every step should reach excellence,What you see, you use our products, you choose, you feel that we do our best,this is our faith. Dry Ovens are used to dry or temper electronic components,material tests,torrefaction, wax-melting ,high temperature aging ,preheating and sterilization in industrial and mining enterprises, laboratories and scientific research institutes. .Exterior chamber is made by reinforced steel with painting; working chamber made by anti-corrosion stainless steel SUS#304 .Intelligent PID control, LED controller with over-temperature alarm,timing range within 0~9999min .Hot air circulation system composed of Germany imported low-noisy air blower and optimal air duct which ensure uniform temperature distribution .Double layers of glass door, large transparent window to observe specimen .Forced air convection Climatest manufactures desktop and floor-standing models with RT+10°C-200°C,250°C,300°C,350°C,400°C temperature range,and customized as per special requirement,if you wanna know more details about our dry oven,please visit our product page:http://climatechambers.com/industrial-dry-oven/200-degree-c-hot-air-oven.html...

Publisher: Symor Instrument Equipment Co.,Ltd

Symor Instrument Equipment Co.,Ltd

Climatest Symor® is the leading environmental simulation testing equipment manufacturer in China established in 2001, located at Dayang Industrial Park,Hefei,China.

Hefei, China

Manufacturer of Test Equipment

How to inspect the temperature recovering time of thermal shock chamber?

Nov 12, 2019 | climatest symor

Thermal shock test chamber can be used for testing the chemical change or physical damage on composite materials caused by the thermal expansion and contraction of the sample in the shortest time,which is subjected to extremely and continuous high and low temperature environment.so how to check the temperature recovery time of this chamber? Normally we take following steps to inspect the temepratuire recovering time: 1.Install the temperature sensor at the specified position, and adjust the temperature controller of hot zone and cold zone to the required nominal temperature respectively. 2.The temperature increases and reduces respectively,30min after temperature in two zones reach stable status,record temperature value of the measuring point,pls set the temperature value of two zones to be required nominal temperature. 3.The temperature shock test chamber automatically places the inspected load into theh ot zone,select the corresponding retention time according to regulated standard. 4.Set the transfer time,then the inspection load is transferred from hot zone to cold zone, and the temperature of the measuring point is observed and recorded, and then the reverse conversion of the load from cold zone to hot zone is carried out according to the same method, and the temperature of the measuring point is observed and recorded. www.climatechambers.com...

Publisher: Symor Instrument Equipment Co.,Ltd

Symor Instrument Equipment Co.,Ltd

Climatest Symor® is the leading environmental simulation testing equipment manufacturer in China established in 2001, located at Dayang Industrial Park,Hefei,China.

Hefei, China

Manufacturer of Test Equipment

Origin and Quantification of Increased Core Loss in MnZn Ferrite Plates of a Multi-Gap Inductor

Nov 07, 2019 | Dominik Neumayr, Dominik Bortis, Johann W. Kolar, Stefan Hoffmann, Eckart Hoene

Inductors realized with high permeable MnZn ferrite require, unlike iron-powder cores with an inherent dis-tributed gap, a discrete air gap in the magnetic circuit to prevent saturation of the core material and/or tune the inductance value. This large discrete gap can be divided into several partial gaps in order to reduce the air gap stray field and consequently the proximity losses in the winding. The multi-gap core, realized by stacking several thin ferrite plates and inserting a non-magnetic spacer material between the plates, however, exhibits a substan-tial increase in core losses which cannot be explained from the intrinsic properties of the ferrite. In this paper, a comprehensive overview of the scientific literature regarding machining induced core losses in ferrite, dating back to the early 1970s, is provided which suggests that the observed excess core losses could be attributed to a deterioration of ferrite properties in the surface layer of the plates caused by mechanical stress exerted during machining....

Publisher: Power Electronic Systems Laboratory (PES)

Power Electronic Systems Laboratory (PES)

The research projects at the PES cover a wide range of application areas and all basic forms of power electronic energy conversion

Zurich, Switzerland

Research Institute / Laboratory

When you pull out the nitrogen pipe of nitrogen cabinet

Nov 07, 2019 | climatest symor

Many customers who have purchased the nitrogen cabinets have been in the mistaken belief that the air pipe can be pull down hard,so that it can cause the board to be damaged due to the hard pulling of the air pipe, which leads to the replacement of the penetrating board. Now, the following pictures are provided. Please note: Nitrogen cabinet is a optiomal choice for the microelectronics,semiconductor for humidity proof and anti-oxidation purpose,Climatest has put much efforts on the R&D of dry cabinets,as you know,our advangtage is to handle temperature and humidity,since early 1990s,our engineers began to test and research dry cabinet and nitrogen cabinet,all of our manufacturing process strictly follow ISO9001 standard,we supply to international customers for 20 years,if you are still looking for a reliable dry cabinet manufacturer to protect your MSD from moisture related damage,come to visit www.climatechambers.com,we are ready!...

Publisher: Symor Instrument Equipment Co.,Ltd

Symor Instrument Equipment Co.,Ltd

Climatest Symor® is the leading environmental simulation testing equipment manufacturer in China established in 2001, located at Dayang Industrial Park,Hefei,China.

Hefei, China

Manufacturer of Test Equipment

Embedded Inductors with Laser Machined Gap

Oct 30, 2019 | Jim Quilici

This work presents the fabrication of embedded inductors and the experimental laser machining of gaps in the underlying ferrite structure. (...) Energy efficiency is a major driver in the evolution of electronics and electronics packaging. To manage power consumption, portable appliances (smartphones, tablets, e-readers etc.) often use multiple supply voltages and DC/DC converters. Most are based on switch mode power conversion (SMPC). In a power converter, inductors and transformers are used to temporarily store energy during switching cycles. They also have the function of filtering noise. The power magnetics are often the largest and most expensive devices in the circuit. Integrating the magnetics into either a power converter module or system board can significantly reduce size and cost of the power converter function....

Publisher: Radial Electronics

Radial Electronics

Radial Electronics develops magnetic components and subsystems for data communication, power conversion, and RF applications.

El Dorado Hills, California, USA

Components / Substrates

Why we need to proceed temperature humidity test?

Oct 29, 2019 | climatest symor

For every 10 ℃ increase in temperature, the reaction rate is twice to three times. This means that for every 10 ℃ increase in temperature, the life span of the product will be halved, and when the temperature rises by 20 ℃, the life span of the product will be reduced to 1/4. High temperature will lead to aging, oxidation, evaporation, physical deformation and so on. Low temperature will lead to embrittlement, ice formation, viscosity and solidification degree, loss of mechanical strength, physical shrinkage and so on. When the product is shipped, stored and operated in the environment, it will be endangered. In addition, each product has regulatory and certification requirements, and it is important to evaluate reliability and durability before it is put on the market. In general, according to the IEC60068 test standard, it requires the volume of the laboratory to be at least five times the total volume of the sample under test. Haida constant temperature and humidity box can help you meet this demand. So with the fast developmement of manufacturing industry,test becomes a necessity to see wether the product is able to meet regulated standards in R&D satge,Climatest Symor specializes in handling temperature and humidity,we supply environmental test chamber to China State-owned Research Institutes and laboratories,and obtain excellent reputation from international cllients,our company put much efforts on chamber R&D ,striving to supply best-quality climate simulation equipment and after-sale service. For details,pls visit our official website www.climatechambers.com...

Publisher: Symor Instrument Equipment Co.,Ltd

Symor Instrument Equipment Co.,Ltd

Climatest Symor® is the leading environmental simulation testing equipment manufacturer in China established in 2001, located at Dayang Industrial Park,Hefei,China.

Hefei, China

Manufacturer of Test Equipment

Thermal Profiles - Why Getting Them Right is Important

Oct 24, 2019 | Fred Dimock

Presentation given by Fred Dimock during a seminar at the American Competitiveness Institute, ACI. •Recipe vs. Profile •Material Properties •Why profiles are shaped like they are. •Obtaining profiles •TC Accuracy •Profilers •Test vehicles •Process Window – Eutectic vs. Lead Free •Heat transfer •Oven Control...

Publisher: BTU International

BTU International

Global supplier of advanced thermal processing equipment and processes to the electronics assembly market.

North Billerica, Massachusetts, USA

Manufacturer of Assembly Equipment

Printed Circuit Board Assembly & Choosing a Vendor

Oct 24, 2019 | Nian Zhen

Making your novel electronic item design ready for mass fabrication and <a href="http://www.optimatech.net/">printed circuit board assembly</a> consists of a lot of steps as well as risks. I will provide a few recommendations about how to neglect pricey errors and how to reduce the time to promote your novel item designs. You can hire printed circuit board assembly services for this. As soon as you have accomplished your product as well as printed circuit board design, you wish to get started developing prototypes prior to you commit to big fabrication volume. A lot of design software packages, for instance, PCB layout design software, as well as an industrial design software program, possess simulation potentials incorporated. Carrying out a simulation facilitates curtailing numerous design mistakes prior to the first prototype is developed. In case you are developing an intrusive item, you might desire to think about a modular design wherein all of the chief functionalities are situated in individual modules. All through your testing, you could then swap modules that don’t cater to the design limits. Spinning individual modules would be swifter and more cost-effective in comparison to spinning a complete design. Counting on the design intricacy, you can mull over manually mounting printed circuit board elements to bank dollars. Nonetheless, for medium to big intricacy this procedure likely to be very time taking, typically in case you wish to create numerous prototypes. Hence it makes sense thinking about a contract manufacturer for the assembly. Whilst running miniature quantity fabrication runs, the fabrication setup expenditure will usually control the by and large prototype constructs expenditure. Whilst seeking a subcontractor, it is finest to choose a vendor that focuses on prototype builds to reduce the cost. Prototype printed circuit board fabricators characteristically join the circuit boards of a number of clients which efficiently shares the setup expenditure in the midst of some customers. The disadvantage is that you would characteristically only be able to want among numerous standard printed circuit board material thicknesses as well as sizes. Apart from choosing a supplier with low setup expenditure, choosing a firm that would moreover be capable to manage your whole fabrication runs curtails mistakes because switching fabricators have the chance of errors owing to a specific supplier interpreting fabrication design data in a different way. This manner your design is already translated into the particular machine data that implies little or no setup expenditure for your final fabrication. A few <a href="http://www.optimatech.net/pcb.aspx">PCB</a> manufacturers also provide printed circuit board design services that are awesome plus if you do not possess experience with the design. Moreover, these vendors would be capable to help you in case there are issues with your design folders and be capable to detect issues prior to the fabrication. ...

Publisher: Optima Technology Associates, Inc.

Optima Technology Associates, Inc.

Printed Circuit Board constitutes an essential part of any electronic device and Optimatech.net offers every step of your electronic assembly needs looking forward to work with you.call:717 932 5877

PA, Pennsylvania, USA

Assembly

Investigation of PCB Failure after SMT Manufacturing Process

Oct 21, 2019 | ACI Technologies, Inc.

An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead)....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Essentials about Printed Circuit Board Assembly

Oct 18, 2019 | Nian Zhen

It usually does not make any logic to invest in costly fabrication equipment in case you just desire to spin some prototypes and rather outsource your Printed Circuit Board assembly as well as prototype fabrication to a trustworthy vendor. I would provide a few tips as to what to consider when seeking a contract manufacturer. The two most common procedures associated with <a href="http://www.optimatech.net">Printed Circuit Board Assembly</a> are through-hole technology and surface mount technology. Talking about the difference between through-hole technology and surface mount technology. Through-hole elements have metal leads, & these metal leads are supplied through-plated holes inside the circuit board. On the other hand, SMT elements might or might not have leads, nevertheless most significantly, they are developed to be soldered onto the surface of the circuit boards straight on the same side as the element body. A lot of contract manufacturers would provide a quick quote mechanism over their site for the fabrication of circuit boards as well as assembly of prototypes. This would bank your time when comparing various vendors. Ensure that the quote system facilitates you to fill your details, for instance, board material, thickness, copper thickness, milling, etc. in order that you can avail of a precise quote devoid of any surprises afterward. And this is quite necessary. Typically the cost per board would decline as quality upgrades. This is owing to the fairly high setup price of circuit board fabrication over and above component assembly. A few vendors would employ a system where they unite boards from various consumers. This manner the setup price would be circulated among numerous clients. When you fabricate an item, you clearly don’t desire to have to fabricate a big quantity of boards straight away whilst you improve your design. One restriction with small quantity prototypes though is that the option of materials &amp; material thicknesses would be constrained. In case you are employing a particular material then opportunities are there will not be any other clients employing the same material. Additionally, lead time plays a major role in indecisive prices. A longer lead time facilitates the fabricator more liberty in slotting your fabrication. This is basically reflected in cheaper prices that would view in the quote section. Clearly, if you are in a hurry and desire to be moved to the summit of the pile you would require splurging more dollars. Ensure that your contract fabricator would support the file sort for producing which you offer. The most general format for printed circuit board fabrication is the Gerber format nonetheless a few vendors would moreover embrace board files from general printed circuit board software products. A few suppliers also provide in house printed circuit design. Even in case, you create your board yourself, choosing a vendor with design services might prove resourceful in case there is an issue with your files. In this scenario, your vendor could make swift changes that would neglect pricey delays. If you are looking for an <a href="http://www.optimatech.net/pcb-ems.aspx">Electronic Manufacturing Services</a> (EMS Assembly) provider, then the web is the best to search. ...

Publisher: Optima Technology Associates, Inc.

Optima Technology Associates, Inc.

Printed Circuit Board constitutes an essential part of any electronic device and Optimatech.net offers every step of your electronic assembly needs looking forward to work with you.call:717 932 5877

PA, Pennsylvania, USA

Assembly

Autonomous Driving - New systems to optimally apply potting media

Oct 17, 2019 | Scheugenpflug

There has been an increase in sealing and encapsulation applications mainly in the field of autonomous driving. Safety and assistance systems already make driving safer and more comfortable today. With increasing progress even more electronic systems will be added. The smooth functioning of computers, sensors, cameras, etc. - and thus our safety as road users - also depends on optimally applied potting media. These can be applied economically, quickly and with high quality in individual applications and are now mastered. With the changing mobility concepts, however, the prerequisites in manufacturing are changing. The requirements are often not fixed at the outset, but only develop during the course of the project. The aim here is to generate a flexible standard that enables attractive pricing and short delivery times. However, we are prepared for these developments: with our modular system consisting of scalable system modules. From this, individual processes can be taken and combined according to requirements. Our new LiquiPrep systems have recently become part of this modular system. They represent a further development of the proven A310 product family and enable reliable processing and conveying of self-levelling media. In addition to a significantly more intuitive operation, the LiquiPrep systems also offer higher performance thanks to a new, patented membrane pump and an optimized agitator. Image: Optimally applied sealants and casting materials form the basis for high quality and smooth functioning of the components. ...

Publisher: Scheugenpflug Inc.

Scheugenpflug Inc.

Specializes in automated metering & dispensing solutions, supplier of resin metering systems, global expert in production and process automation, vacuum dispensing production systems, and systems for dispensing of abrasive media.

Kennesaw, Georgia, USA

Manufacturer of Assembly Equipment, Adhesives / Dispensing, Assembly, Component Preparation

Effect Of Voids On Thermo-Mechanical Reliability of Solder Joints

Oct 16, 2019 | Morgana Ribas, Ph.D., Siuli Sarkar, Ph.D., Carl Bilgrien, Ph.D., Tom Hunsinger - Alpha Assembly Solutions, MacDermid Performance Solutions

Despite being a continuous subject of discussion, the existence of voids and their effect on solder joint reliability has always been controversial. In this work we revisit previous works on the various types of voids, their origins and their effect on thermo-mechanical properties of solder joints. We focus on macro voids, intermetallics micro voids, and shrinkage voids, which result from solder paste and alloy characteristics. We compare results from the literature to our own experimental data, and use fatigue-crack initiation and propagation theory to support our findings. Through a series of examples, we show that size and location of macro voids are not the primary factor affecting solder joint mechanical and thermal fatigue life. Indeed, we observe that when these voids area conforms to the IPC-A-610 (D or F) or IPC-7095A standards, macro voids do not have any significant effect on thermal cycling or drop shock performance....

Publisher: Alpha Assembly Solutions

Alpha Assembly Solutions

Alpha Assembly Solutions is a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places.

South Plainfield, New Jersey, USA

Manufacturer of Assembly Material

Advanced Packaging Technology

Oct 16, 2019 | ACI Technologies, Inc.

A major goal of the development of advanced packaging technology is to reduce the size, weight, and power consumption of electronics components using state-of-the-art commercial technologies. One of the novel concepts involves the use of all three spatial dimensions when designing and producing new systems. In the past, electronic structures tended to be two dimensional in nature. Generally speaking, individually packaged integrated circuit (IC) dies were interconnected on printed circuit boards. Techniques such as die and package stacking naturally contribute to a reduction of the spatial footprint of any given electronic system design. ...

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Fill the Void IV: Elimination of Inter-Via Voiding

Oct 10, 2019 | Tony Lentz - FCT Assembly, Greg Smith - BlueRing Stencils

Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs.</p><p> Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted.</p><p> In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."...

Publisher: FCT ASSEMBLY, INC.

FCT ASSEMBLY, INC.

With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.

Greeley, Colorado, USA

Manufacturer of Assembly Material, Soldering

Power Interfaces

Oct 07, 2019 | ACI Technologies, Inc.

Power interfaces are required when external power sources like solar panels, fuel cells, or batteries are used to generate power for electrical devices. There are two major power interfaces commonly used, direct current to direct current (DC/DC) converters and direct current to alternating current (DC/AC) inverters. While both interfaces are designed to convert from variable DC inputs, they output to different power standards and power levels that are used in different applications....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

Effects of Temperature Uniformity on Package Warpage

Oct 03, 2019 | Neil Hubble, Charly Olson

Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfaces must stay relatively flat with one another or surface mount defects, such as head-in-pillow, open joints, bridged joints, stretched joints, etc. may occur. Initial package flatness can be affected by numerous aspects of the component manufacturing and design. However, change in shape over temperature is primarily driven by CTE mismatch between the different materials in the package. Thus material CTE is a critical factor in package design. When analyzing or modeling package warpage, one may assume that the package receives heat evenly on all sides, when in production this may not be the case. Thus, in order to understand how temperature uniformity can affect the warpage of a package, a case study of package warpage versus different heating spreads is performed.<p><p>Packages used in the case study have larger form factors, so that the effect of non-uniformity can be more readily quantified within each package. Small and thin packages are less prone to issues with package temperature variation, due to the ability for the heat to conduct through the package material and make up for uneven sources of heat. Multiple packages and multiple package form factors are measured for warpage via a shadow moiré technique while being heated and cooled through reflow profiles matching real world production conditions. Heating of the package is adjusted to compare an evenly heated package to one that is heated unevenly and has poor temperature uniformity between package surfaces. The warpage is measured dynamically as the package is heated and cooled. Conclusions are drawn as to how the role of uneven temperature spread affects the package warpage....

Publisher: Akrometrix

Akrometrix

Leading provider of full-field metrology solutions for substrates and packages in the OEM/CEM/SATS/PCB segments of the microelectronics industry.

Atlanta, Georgia, USA

OEM, Service Provider

Cleanliness/Corrosion Mitigation

Sep 27, 2019 | ACI Technologies, Inc.

One of the most critical factors in preventing corrosion from occurring in electronics is maintaining the state of cleanliness. This is not an easy feat to achieve. Corrosion is defined as the deterioration of a material or its properties due to a reaction of that material with its chemical environment. [1] So, to prevent corrosion from occurring, either the material or the chemical environment must be adjusted. Adjusting the material usually means application of a protective coating or replacing a more reactive material with a less reactive material. Adjusting the chemical environment usually means removing ionic species through cleaning, and removing moisture, usually with a conformal coating or hermetic package. Ionic species and moisture are problematic because they form an electrolyte which is able to conduct ions and electricity. Any metal that comes into contact with the electrolyte can begin to corrode....

Publisher: ACI Technologies, Inc.

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

What is the main function of hot air dry oven?

Sep 25, 2019 | climatest symor

What is the main function of hot air dry oven? Drying ovens are devices used to remove moisture and other solvents from the items placed inside them through a forced convection process, collecting it elsewhere so that the object becomes dehydrated. A drying oven causes objects to dry out through evaporation. Drying ovens use convection heating,also called air forced, in which the object is heated through air currents. Water from the object escapes into the air, raising the humidity level and causing the semi-solid membranes inside the oven to absorb the water. The end result is that the oven removes water from the object being dried, leaving it dehydrated. Drying ovens contain a system for forcing convection currents to develop, usually either a fan or turbine, which aids in the heating and drying process by ensuring that the hot air circulates,many ovens are equipped with an adjustable ventilation system that allows the user to ensure that the system has an adequate air supply. For details,pls visit our website: http://climatechambers.com/articles&latestnews/what-is-the-main-function-of-hot-air-dry-oven.html...

Publisher: Symor Instrument Equipment Co.,Ltd

Symor Instrument Equipment Co.,Ltd

Climatest Symor® is the leading environmental simulation testing equipment manufacturer in China established in 2001, located at Dayang Industrial Park,Hefei,China.

Hefei, China

Manufacturer of Test Equipment

Thermal Capabilities of Solder Masks and Other Coating Materials - How High Can We Go?

Sep 24, 2019 | Sven Kramer

This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications. The coatings consist of:</p><p> Specialty (green transparent) liquid photoimageable solder masks (LPiSM) compatible with long-term thermal storage/stress in excess of 150°C. Combined with the appropriate high-temperature base material, and along with a suitable copper pre-treatment, these solder resists are capable of fulfilling higher thermal demands. In this context, long-term storage tests as well as temperature cycling tests were conducted. Moreover, the effect of various Cu pre-treatment methods on the adhesion of the solder masks was examined following 150, 175 and 200°C ageing processes. For this purpose, test panels were conditioned for 2000 hours at the respective temperatures and were submitted to a cross-cut test every 500 h. Within this test set-up, it was found that a multi-level chemical pre-treatment gives significantly better adhesion results, in particular at 175°C and 200°C, compared with a pre-treatment by brush or pumice brush. Also, breakdown voltage as well as tracking resistance were investigated. For an application in LED technology, the light reflectivity and white colour stability of the printed circuit board are of major importance, especially when high-power LEDs are used which can generate larger amounts of heat. For this reason, a very high coverage power and an intense white colour with high reflectivity values are essential for white solder masks. These "ultra-white" and largely non-yellowing LPiSM need to be able to withstand specific thermal loads, especially in combination with high-power LED lighting applications.</p><p> The topic of thermal performance of coatings for electronics will also be discussed in view of printed heatsink paste (HSP) and thermal interface paste (TIP) coatings which are used for a growing number of applications. They are processed at the printed circuit board manufacturing level for thermal-coupling and heat-spreading purposes in various thermal management-sensitive fields, especially in the automotive and LED lighting industries. Besides giving an overview of the principle functionality, it will be discussed what makes these ceramic-filled epoxy- or silicone-based materials special compared to using "thermal greases" and "thermal pads" for heat dissipation purposes....

Publisher: Lackwerke Peters GmbH + Co KG

Lackwerke Peters GmbH + Co KG

Lackwerke Peters has progressively evolved into one of, if not the market leader for coating materials for assembled pcbs / flat packs in Europe, which includes renowned companies from aviation and aerospace technolog

Kempen, Germany

Manufacturer of Assembly Material

TDK Navitasys India X Ray case

Sep 23, 2019 | Joy Rong +8618779975930 info@seamarkxray.com

TDK Navitasys India X Ray case Navitasys India private Limited is belong to TDK Electronics AG (previously EPCOS AG) develops, manufactures and markets electronic components and systems under the product brands of TDK and EPCOS, focusing on fast-growing leading-edge technology markets, which include automotive electronics, industrial electronics and consumer electronics as well as information and communications technology.  China branch and India branch already purchased ZM X7800 X ray inspection machine in this year, At September 2019, Navitasys India private Limited factory get ready to Manufacture the Motorola electronics Products series, Seamark ZM sent engineer to India for install and train x ray inspection machine, For x ray series machine, Seamark ZM are working with the world-leading suppliers, including VJ technology(USA), Korea Rayence, Hamamatsu Photon(Japan), Teledyne Dalsa (USA) and iRay(China), Omron(Japan), Googoltech(China) etc. TDK Navitasys India X Ray case image It is great to know more and more companies are pay attention to products’ quality, Like TDK Electronics AG, There are many secrets to their success, and quality is one of them. Family of Industrial X-ray inspection machine & BGA rework station Last Article: Rashmi Rare Earth X Ray Machine Training Next Article:x ray inspect PCB and SMT patch module TSI Mexico use Seamark x ray machine Persang Alloy Industries X ray 6600 for PCB Maybe you still are interested in: Solder paste printing defects and solutions in SMT chip processing process Advantages of X-ray SMD counter ...

Publisher: Seamark zm Tech Group

Seamark zm Tech Group

Seamark ZM PCB BGA X-ray Inspection system Equipment -14 years experience in SMT field, Our experience will provide good solutions. X-Ray Inspection, BGA reworks tation,Full auto X ray SMD component machine

Shenzhen, China, China

Inspection

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